Dr. Ashok Muthukumaran

Senior Director of Advanced Packaging and Head of Integration at Applied Materials, Singapore,

Dr. Ashok Muthukumaran is a semiconductor technology leader with over 20 years of experience driving advanced process and integration innovations across the United States and Singapore. He earned his Ph.D. in Materials Science & Engineering from The University of Arizona and began his career at Intel Corporation, where he led CMP development spanning the 65nm through 14nm technology nodes. He later served as Technology Development Director for 3D NAND at Micron Technology in Singapore, where he achieved an unprecedented "three-peat" in technology leadership by enabling the industry's first Gen 7, Gen 8, and Gen 9 NAND technology nodes. Dr. Ashok is currently Senior Director of Advanced Packaging and Head of Integration at Applied Materials, Singapore, where he leads the development of next-generation heterogeneous integration technologies and drives strategic customer technology enablement for AI and high- performance computing applications. He is a recognized thought leader and invited speaker at major industry forums, including SEMICON Taiwan (2026), SEMICON Southeast Asia (2026), and IEEE EDTM (2026), where he has presented on advanced packaging and system-level scaling technologies. He has also been invited to engage with the Government of India and industry stakeholders in shaping India's semiconductor strategy and long-term vision. He has authored more than 100 publications and patents and has received numerous industry recognitions, including the Micron Innovation Award, Micron CEO Challenge Award, Intel Achievement Awards, the NACE Award, and the SRC Award.