Opening Speech
Dato’ Seri Wong Siew Hai
President of Malaysia Semiconductor Industry Association (MSIA)

Keynote Address
Jean-Christophe Eloy
Founder & Chairman of Yole Group

Global Semiconductor Outlook
AI is reshaping the semiconductor industry. Data-center demand for GPUs, custom accelerators and HBM is driving growth and capital spending, while automotive, industrial and consumer markets are still recovering unevenly. This Yole Group masterclass looks at the market's path toward the $1+ trillion mark, how AI and non-AI segments are diverging, and how wafer capacity, foundry dynamics and geopolitics are redrawing the supply chain.
Claire Troadec / Jérôme Azémar
Director of Global Semiconductor Activities Yole Group / Services Director & Principal Analyst Yole Group

Heterogeneous Integration & Advanced Packaging
Transistor scaling alone can no longer deliver the performance gains the industry needs, so packaging now drives innovation. Chiplets, 2.5D/3D integration, hybrid bonding and panel-level packaging are changing how high-performance systems are designed and built. This session maps the technologies, players and investment flows behind advanced packaging, from CoWoS-class interposers to glass substrates.
Tan Yik Yee
Principal Technology & Market Analyst, Semiconductor Packaging Yole Group

Silicon Photonics & Photonics Packaging
As AI clusters grow, copper interconnects are reaching their limits, and photonics is moving to the center of data-center architecture. Pluggable optical transceivers at 800G and 1.6T, linear-drive optics and co-packaged optics are pushing silicon photonics to volume production. Packaging and fiber coupling have become the main obstacles to cost and scale. This masterclass covers the market, the technology roadmaps and the supply chain, and shows where photonics packaging and testing open new opportunities for semiconductor manufacturing.
Claire Troadec / Jérôme Azémar
Director of Global Semiconductor Activities Yole Group / Services Director & Principal Analyst Yole Group