Dr Eu Poh Leng

Senior Director, Package Innovation, NXP Semiconductors

Dr. Eu Poh Leng is a highly accomplished semiconductor packaging expert with 29 years of industry experience, having held key roles at Motorola, Freescale, and NXP Semiconductors. She possesses deep expertise in both conventional and advanced packaging technologies, including Panel Level Packaging. Since 2019, she has been leading a global team responsible for the development, qualification, and launch of new products across 18 OSATs worldwide. A prolific contributor to the field, she has published 88 technical papers and holds 28 patents. Dr. Eu is actively involved in the professional community, serving as an Exco member of MSIA Aurum, IEEE Region 10, and IEEE Malaysia. She is also a former Chair of the IEEE Electronics Packaging Society and a recipient of the IEEE Women in Engineering Award, among numerous other accolades.